With the introduction of any new component, enters a flurryof fresh jargon. To keep you updated, here are the most common and the latestterms you’d come across for PC components. Processors Athlon: AMD’s high-end processor, which is in directcompetition with Intel’s PIII processors. Also called K7.
Boxed processor: This is a microprocessor that’s sold in aretail box pack, which you can buy one at a time. OEMs (Original EquipmentManufacturers) buy them in larger quantities, usually a thousand. Intel startedthis initiative by providing its processors in retail packaging. So the CPU, beit PIII, Celeron, or Xeon, is now available in a box with a heatsink/fan and aninstruction manual. Cache: A very small quantity of high-speed storage (normallyRAM) that is used to store data before sending it to a faster component. Forexample, the cache on the CPU stores data from the RAM before processing. L1 cache (Level 1 cache): This is a small piece of very fastmemory that sits on the CPU chip itself. The CPU works very fast, and it needssomething to store instructions before it executes them. L1 cache holds theseinstructions for the CPU, and passes them quickly. L2 cache (Level 2 cache): This is another piece of very fastmemory. Earlier, it used to reside on the motherboard. Nowadays, it sits on thesame die as the microprocessor, be it PIII, Athlon, or Celeron. This worksfaster than the one on the motherboard. The data from the RAM first passes tothe L2 cache and then it heads for the L1 cache before being processed by theCPU. Celeron: Intel’s processor for the entry-level market.Though it looks similar to the new PIII, the underlying architecture is quitedifferent. Coppermine: This is the code name for the latest version ofthe Intel PIII processor. It fits into a FC-PGA 370 socket, unlike the initialPIIIs that went into Slot 1. The new chip has many enhanced features over theearlier one. One important change is reduction of the L2 cache from 512 kB to256 kB. The other important change is placing the cache on the same die as theprocessor itself. Crusoe: A new line of processors, from Transmeta, targeted atnotebooks and embedded devices. These are said to generate very low heat andthus increase battery life. Duron: This is an entry-level processor from AMD, acompetitor to Intel’s Celeron processors. It uses the Socket 462 interface ona motherboard. Earlier, the entry-level chips from AMD were the K6-2 and K6-3.With the introduction of Duron, these are likely to be phased out. FC-PGA 370 (Flip Chip Pin Grid Array): This is the latestsocket for Intel processors. It can take either a PIII or a Celeron processor. Slot 1: Before the FC-PGA socket design was introduced, olderIntel PIII (Katmai) processors were available in a slot design called Slot 1.The processor looked more like a video-game cartridge with a huge fan on top ofit. It fit into a slot just like an ordinary card inside your PC. This designhad the L2 cache and the processor on the cartridge. With the new FC-PGA design,the L2 cache was moved on to the same chip as the processor. Slot A: This is meant for AMD Athlon processors. It’ssimilar to Intel’s Slot 1 architecture, the one used in earlier PIIs and PIIIs. Socket 462: This is used to refer to the socket that housesthe Duron—the latest processor from AMD.
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